50pcs Stencils Template for Game XBOX360 PS3 PS4 GPU CPU SLIM RAM X850744-004

Description: 100% Brand New These stencils were made by high quality steel ,can be heated directely by the hot air gun,it is easy and quickly for reballing the BGA IC. 50 pcs Stencils templates as following： Stencil XBOX360 PS3 PS4 GPU CPU SLIM RAM XCGPU X850744-004 DDR Update 50pcs heat directly stencils as follow 　 XBOX 360CPU 0.6 1 XBOX 360GPU 0.6 1 XBOX 360HANA 0.6 1 XBOX 360CSP（XBOX 360 Southbridge） 0.6 1 XBOX360 XCPU C-A01 0.6 1 XB360AV 0.6 1 XBOX360-GPU-B 0.6 1 XBOX360-KSB X850744-004 0.55 1 PS3-CPU(new model) 0.6 1 PS3-GPU(old model) 0.6 1 CPS3 CPU BALL 0.6 1 PS3-CXR714120//CXR714123 ( PS3-CXD714120 0.6 1 PS3 CXD2964GB 0.6 1 PS3 CXD2973GB//2976GB 0.6 1 WII GPUAA(new model) 0.6 1 WII GPU(old model) 0.6 1 WII CPU(new model) 0.6 1 WIICPUB 0. 5 1 CXD2949CGB 0.76 1 CXD2972GB 0.6 1 CXD2976GB 0.6 1 CXD2980BGB//CXD29808 0.6 1 CXD2992GB PS3 SLIM 0.6 1 CXD7203-15 0.76 1 CXD9209GB 0.6 1 CXD9799GB (CAD9799GP) 0.76 1 CXD9833GB 0.76 1 CXD1876 0.35 1 CXD2981GB 0.6 1 CXD4140GG LFGA-97 0.45 1 CXD5148GG LFBGA-64 0.45 1 PSP-1/5209 （0.3mm Soler Ball） 1 PSP-2/2975 （0.3mm Soler Ball） 1 PSP-3 （0.3mm Soler Ball） 1 PSP-4 （0.3mm Soler Ball） 1 PS3-5CPU （0.3mm Soler Ball） 1 PSP-6 （0.3mm Soler Ball） 1 PSP-7 （0.3mm Soler Ball） 1 PSP3-1 （0.3mm Soler Ball） 1 PSP-MB44C018A （0.3mm Soler Ball） 1 PSP-LR38807 （0.3mm Soler Ball） 1 833KM3E （0.3mm Soler Ball） 1 L8GV7657 （0.3mm Soler Ball） 1 PSP-Z7-201A（PSP-27-201A） （0.6mm Soler Ball） 1 CXD2929GB KF 0.6 1 PS3-2 0.6 1 PS4 GPU CXD90026G 0.55 1 PS4 CPU CXD90025G 0.5 1 PS4 SDRAM K4B2G1646E-BCK0 0.45 1 PS4 GDDR5 K4G41325FC-HC03 0.45 1

Dear Buyers, Please pay attention to the following instruction upon receipt our chips The BGA chips you buy from our company are of high technology and as precise as nanometer.For small quantity of chips, they are exposed to the air after being taken out from package.So they probably will adhere to some humidity.Thus, in order to avoid quality problem, we suggest that you put them inside a baking chamber for at least 24 hours at 100℃-110℃。 When soldering, please control the temprature precisely.Lead-Free/No Pb BGA chips is 245℃--260℃ (Maximum) Leaded/Pb BGA chips 180℃--205℃ (Maximum).The soldering process is complicated.Soldering/replacing chips must be operated by engineers who have proficient skills.As BGA chips are fragile, complicatedly structured, with numerous balls, any slightly faulty positioning, careless temperature-control, or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.The chips will, as a result, die.BGA chips are easily get broken by improper soldering.Before buying, you should consider 3 points: 1) Have you bought the right chips? 2) Do you have proper equipment? 3) Are you skillful enough to solder the chips?

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